Wafer AOI Inspection Platform

High-resolution surface inspection platform concept for wafer and advanced packaging processes.

Wafer 200 / 300 mm

Resolution 1.2 μm optical

Throughput Up to 45 WPH

Handling FOUP compatible

Prepare RFQ View manufacturer

COMMERCIAL FRAME

Illustrative sourcing details

Minimum order: 1 platform
Indicative lead time: 16–20 weeks
Standards workflow: SEMI-oriented design
Applications: Wafer inspection · Advanced packaging

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